Apple iPhone 7 reportedly to be 6.1mm thick; ditch headphone jack, camera bump; gain stereo speakers

Apple is reportedly making the next iPhone thinner than the previous iPhone models. It was previously reported that Apple would be ditching the 3.5mm audio jack, and make some other changes to make the iPhone 7 slimmer.

Now according to Japanese tech blog Mac Otakara, the iPhone 7 will have a design same as the iPhone 6 and 6s model, but will be thinner by almost 1mm. To recall the iPhone 6s is 7.1mm thin.

In line with previous reports, the report claims that the iPhone 7 will ditch the 3.5mm headphone jack. This also means that the lightning port will be an all-in-one port supporting both charge and headphone. Apple is also said to do away with the small camera bump at the rear, so that the rear camera stay flush with the body of the phone. Also to make the iPhone 7 slimmer, the lightning port cutout will be thin, allowing reduction in size.

The new iPhone will come with aluminum material and the same level of water resistance as the iPhone 6s. The report also mentions that the iPhone 7 will sport a dual-speaker setup and will not have the antenna lines on the back.

As usual we can expect the iPhone 7 and 7 Plus at Apple's keynote event that happens in September. But before that, on March 21, Apple will host a media event where the 4-inch iPhone (iPhone SE), 9.7-inch iPad Pro (iPad Pro Mini) and new Apple Watch bands are expected to announce.

Via

Kaiser Bey

Kaiser is a tech enthusiast who likes to write, read and talk about tech. He dreams of going to Mars and never come back. We hope that you find his posts on AndroGuider helpful and informative