Qualcomm reveals full specs of Snapdragon 845

Qualcomm on the second day of its annual Snapdragon Technology summit in Hawaii has revealed full details of its next flagship processor, the Snapdragon 845, which will be faster than Snapdragon 835 chip. 

The Snapdragon 845 is said to be 30 percent more power efficient than Snapdragon 835 and comes with Adreno 630 GPU, which offers 30 percent improved graphics, video rendering and power reduction compared to the previous generation.

It uses Kyro 385 CPU with four cores handling powerful tasks, and the rest four are power-efficient cores to handle day-to-day activities. The four powerful cores are clocked at up to 2.8GHz and offers 25 percent better performance that Snapdragon 835's Kyro 280 CPU. The four power efficient cores are clocked at 1.8GHz, and promises 15 percent improved performance. The chipset  is manufactured using Samsung 10n FinFET process technology.

The chipset also houses a spectra 280 ISP (image signal processor), a Hexagon 685 DSP (digital signal processor), AQustic Audio, as well as Qualcomm's fastest model X20 Gigabit LTE radio.

The Spectra 280 ISP enables "Ultra HD premium capture", which means phone equipped with the chipset is capable of capturing 4K HDR videos at 60fps (frames per second) with support for up to 480fps slow-mo recording at 720p.

As for connectivity, the Snapdragon 845’s X20 LTE modem supports LTE Category 18 peak download speeds of 1.2 Gbps, Dual SIM-Dual VoLTE as well as 4×4 MIMO on up to 3 aggregated carriers. It has support for the latest Wi-Fi 802.11 ad.

For security, Snapdragon 845 supports fingerprint, iris, voice and face technology, while Qualcomm's new Aqstic audio codec promises to deliver improved wake-word recognition, as well as improved playback and record features. The chipset also support Qualcomm's Quick Charge 4+ technology, that is 30 percent more power efficient and can charge up to 15 percent faster than Quick Charge 4

Check out the complete specs and features of Snapdragon 845 below:
Qualcomm Spectra 280 ISP

• Ultra HD premium capture
• Qualcomm Spectra Module Program, featuring Active Depth Sensing
• MCTF video capture
• Multi-frame noise reduction
• High-performance capture up to 16MP @60FPS
• Slow motion video capture (720p @480 fps)
• ImMotion computational photography 

Adreno 630 Visual Processing Subsystem

• 30% improved graphics/video rendering and power reduction compared to the previous generation
• Room-scale 6 DoF with SLAM
• Adreno foveation, featuring tile rendering, eye tracking, multiView rendering, fine grain preemption
• 2K x 2K @ 120Hz, for 2.5x faster display throughput
• Improved 6DoF with hand-tracking and controller support

Qualcomm Hexagon 685 DSP

• 3rd Generation Hexagon Vector DSP (HVX) for AI and imaging
• 3rd Generation Qualcomm All-Ways AwareTM Sensor Hub
• Hexagon scalar DSP for audio 

Snapdragon X20 LTE Modem

• Support for 1.2 Gbps Gigabit LTE Category 18
• License Assisted Access (LAA)
• Citizens Broadband Radio Service (CBRS) shared radio spectrum
• Dual SIM-Dual VoLTE (DSDV) 

Connectivity

• Multigigabit 11ad Wi-Fi with diversity module
• Integrated 2×2 11ac Wi-Fi with Dual Band Simultaneous (DBS) support
• 11k/r/v: Carrier Wi-Fi enhanced mobility, fast acquisition, and congestion mitigation
• Bluetooth 5 with proprietary enhancements for ultra-low power wireless earbud support and direct audio broadcast to multiple devices 

Secure Processing Unit

• Biometric authentication (fingerprint, iris, voice, face)
• User and app data protection
• Integrated use-cases such as integrated SIM, Payments, and more 

Qualcomm Aqstic Audio

• Qualcomm Aqstic audio codec(WCD934x):
• Playback ㄧDynamic range: 130dB, THD+N: -109dB; Native DSD support (DSD64/DSD128), PCM up to 384kHz/32bit; Low power voice activation: 0.65mA
• Record ㄧDynamic range: 109dB, THD+N: -103dB; Sampling: Up to 192kHz/24bit 

Qualcomm Quick Charge 4+ 

Kryo 385 CPU

• Four performance cores up to 2.8GHz (25 percent performance uplift compared to the previous generation)
• Four efficiency cores up to 1.8GHz
• 2MB shared L3 cache (new)
• 3MB system cache (new) 

10-nanometer (nm) LPP FinFET process technology 

Qualcomm says first smartphone utilizing the Snapdragon 845 chip will be unveiled in early 2018. Xiaomi has already confirmed that its upcoming flagship Mi 7 will use Snapdragon 835 chip, and other OEM such as Samsung, LG, HTC, Sony, OnePlus among others will also bring Snapdragon 845 powered flagship device to the market. 

Source | Via

Kaiser Bey

Kaiser is a tech enthusiast who likes to write, read and talk about tech. He dreams of going to Mars and never come back. We hope that you find his posts on AndroGuider helpful and informative